Tetrakis (dimethylamino) titanium (C8H24N4Ti) is a yellow to orange liquid with a strong ammoniacal odor and high reactivity. It is an important titanium precursor, commonly used in chemical vapor deposition (CVD) and atomic layer deposition (ALD) processes to deposit high-purity titanium thin films or titanium dioxide layers. Due to its high volatility and good thermal stability, tetrakis (dimethylamino) titanium is widely used in the semiconductor, optoelectronics, and precision coating industries.
Tris(dimethylamino)cyclopentadienyl hafnium (CpHf) is a high-performance, advanced organometallic precursor specifically designed for ALD and CVD processes. As a liquid at room temperature with excellent volatility, CpHf offers a broader thermal stability window and superior stability compared to traditional hafnium precursors. It can be used to deposit high-quality hafnium oxide and hafnium silicate high-k thin films.
CAS: 908831-34-5 Chemical Formula: C6H17NSi Abbreviation: DIPAS
DIPAS is a liquid aminosilane precursor used for the low-temperature deposition of silicon-based dielectric thin films. Its vapor delivery characteristics and surface reactivity support thermal atomic layer deposition (Thermal ALD) and PEALD processes for depositing SiO₂ and SiNₓ, making it particularly suitable for applications requiring a reduced thermal budget and precise control over film growth.
Tetrakis(Dimethylamino) Hafnium is a low-melting-point hafnium precursor suitable for controlled vapor-phase delivery in ALD/CVD processes. Its melting point range of 26–29°C allows for mild source heating, while the chemical characteristics of its alkylamido groups facilitate the deposition of HfO₂ (for high-k dielectric layers) and other hafnium-based thin films.
2-(Cyclopenta-2,4-dien-1-yl)-N-methylpropan-1-amine, known as CIM, is a Cp-amine ligand intermediate for organozirconium precursor synthesis and ALD/CVD precursor development.
CAS: 35071-66-0 Chemical Formula/Abbreviation: C8H12
1-Isopropyl-1,3-cyclopentadiene is a colorless substituted cyclopentadiene liquid used as an iPrCp ligand precursor for organometallic compounds and specialty synthesis.
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This guide explores the vital chemical precursors used in modern DRAM manufacturing, focusing on high-purity Zirconium (Zr), Hafnium (Hf), Titanium (Ti), and Silicon (Si). It explains how these metal-organic compounds are utilized in ALD and CVD processes to build ultra-thin high-k dielectric layers and electrodes for memory cells. Additionally, it outlines the strict technical criteria—such as optimal volatility, thermal stability, and ultra-high purity—that process engineers require to maximize chip yield at sub-7nm nodes.
Learn how to prevent moisture degradation when handling Y(MeCp)3. Discover expert tips on glovebox transfer, safe storage, and maintaining ALD precursor purity.
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